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Title:
PACKAGING BAG FOR FILLING CRUSHED POLYSILICON MATERIAL AND POLYSILICON PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/190945
Kind Code:
A1
Abstract:
This packaging bag for filling crushed polysilicon material is a packaging bag (1) for directly packaging crushed polysilicon material, the packaging bag being configured of a multilayer film in which a polyethylene resin layer (2) without additives is arranged as the innermost layer and at least a gas barrier layer (3) and a reinforcing material layer (4) are laminated on the polyethylene-based resin layer.

Inventors:
ASANO TAKUYA (JP)
YOKOSE TAKUYA (JP)
ONODA TORU (JP)
Application Number:
PCT/JP2022/008498
Publication Date:
September 15, 2022
Filing Date:
March 01, 2022
Export Citation:
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Assignee:
TOKUYAMA CORP (JP)
International Classes:
B65D77/04; B65D65/40; B65D81/24; B65D85/38
Domestic Patent References:
WO2016047574A12016-03-31
Foreign References:
JP2012101838A2012-05-31
JP2012223942A2012-11-15
JP2002274594A2002-09-25
JP2019006497A2019-01-17
JP2002068725A2002-03-08
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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