Title:
PACKAGING BAG AND PACKAGING MULTILAYER FILM USED IN PRODUCTION OF SAID PACKAGING BAG
Document Type and Number:
WIPO Patent Application WO/2022/054892
Kind Code:
A1
Abstract:
This packaging bag 10 is formed by using packaging multilayer films 5 that each have a heat-sealable resin layer 3 on a surface and attaching the heat-sealable resin layers 3 of the films 5 together. The packaging bag 10 is characterized in that aligned crystals are present in a seal part 7 formed by joining of the heat-sealable resin layers 3.
Inventors:
MAJIMA KENYA (JP)
YOSHIKAWA SEISHI (JP)
SHIBATA KOUKI (JP)
EBATA ATSUSHI (JP)
YOSHIKAWA SEISHI (JP)
SHIBATA KOUKI (JP)
EBATA ATSUSHI (JP)
Application Number:
PCT/JP2021/033241
Publication Date:
March 17, 2022
Filing Date:
September 10, 2021
Export Citation:
Assignee:
TOYO SEIKAN GROUP HOLDINGS LTD (JP)
International Classes:
B32B27/32; B65D30/02; B65D65/40
Domestic Patent References:
| WO2017038349A1 | 2017-03-09 | |||
| WO2017038349A1 | 2017-03-09 |
Foreign References:
| JPS5682247A | 1981-07-04 | |||
| JP2003057790A | 2003-02-26 | |||
| JP2002293372A | 2002-10-09 | |||
| JP2005131859A | 2005-05-26 | |||
| JP2008044356A | 2008-02-28 | |||
| JP2003183462A | 2003-07-03 | |||
| JP2004001889A | 2004-01-08 | |||
| JP2004001888A | 2004-01-08 | |||
| JPH05104689A | 1993-04-27 | |||
| JP4844091B2 | 2011-12-21 |
Attorney, Agent or Firm:
ONO, Hisazumi et al. (JP)
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