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Patent Searching and Data


Title:
PACKAGING BAG AND PACKAGING MULTILAYER FILM USED IN PRODUCTION OF SAID PACKAGING BAG
Document Type and Number:
WIPO Patent Application WO/2022/054892
Kind Code:
A1
Abstract:
This packaging bag 10 is formed by using packaging multilayer films 5 that each have a heat-sealable resin layer 3 on a surface and attaching the heat-sealable resin layers 3 of the films 5 together. The packaging bag 10 is characterized in that aligned crystals are present in a seal part 7 formed by joining of the heat-sealable resin layers 3.

Inventors:
MAJIMA KENYA (JP)
YOSHIKAWA SEISHI (JP)
SHIBATA KOUKI (JP)
EBATA ATSUSHI (JP)
Application Number:
PCT/JP2021/033241
Publication Date:
March 17, 2022
Filing Date:
September 10, 2021
Export Citation:
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Assignee:
TOYO SEIKAN GROUP HOLDINGS LTD (JP)
International Classes:
B32B27/32; B65D30/02; B65D65/40
Domestic Patent References:
WO2017038349A12017-03-09
Foreign References:
JPS5682247A1981-07-04
JP2003057790A2003-02-26
JP2002293372A2002-10-09
JP2005131859A2005-05-26
JP2008044356A2008-02-28
JP2003183462A2003-07-03
JP2004001889A2004-01-08
JP2004001888A2004-01-08
JPH05104689A1993-04-27
Attorney, Agent or Firm:
ONO, Hisazumi et al. (JP)
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