Title:
PACKAGING DEVICE FOR THERMAL PRINT HEAD
Document Type and Number:
WIPO Patent Application WO/2023/082106
Kind Code:
A1
Abstract:
A packaging device for a thermal print head, the packaging device comprising: a box (2), which is arranged outside a packaging device body (1) to create an operating environment; an air distribution transverse pipe (3), which is movably arranged in the box (2) and located at the packaging device body (1) to dry and spray packaging resin; and a fan (4), a heater (6) and a water tank (5), which are fixedly mounted on the top of the box (2), wherein the fan (4) is used to provide airflow, the heater (6) is used to provide heat to air generated by the fan (4), and the water tank (5) is used to cool the air that is heated by the heater (6).
Inventors:
WANG GONGHAI (CN)
Application Number:
PCT/CN2021/129856
Publication Date:
May 19, 2023
Filing Date:
November 10, 2021
Export Citation:
Assignee:
HUNAN KAITONG ELECTRONICS CO LTD (CN)
International Classes:
B41J2/335; B29C35/02; H01L21/56
Foreign References:
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| CN209257321U | 2019-08-16 | |||
| CN109980559A | 2019-07-05 | |||
| JP2010186838A | 2010-08-26 | |||
| JP2002240048A | 2002-08-28 | |||
| CN111564376A | 2020-08-21 | |||
| CN213431832U | 2021-06-15 | |||
| CN212727825U | 2021-03-16 | |||
| CN211575785U | 2020-09-25 | |||
| CN104742529A | 2015-07-01 | |||
| CN112570207A | 2021-03-30 |
Attorney, Agent or Firm:
BEIJING ZHONGDA DEQUAN IP AGENCY CO., LTD. (CN)
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