Title:
PACKAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/175828
Kind Code:
A1
Abstract:
A packaging device according to the present disclosure is used for packing an object which has a top part that forms a protruding curved surface and a protrusion that protrudes sideways from the circumference of the top part. This packaging device comprises: a flat plate; a cylindrical outer member which has an upper end that is in contact with the under surface of the flat plate and a lower end for coming into contact with the protrusion of the object; and an inner member which has an upper end that is in contact with the under surface of the flat plate and a lower end for coming into contact with the protruding curved surface of the top part of the object. The inner member is fixed to the inner surface of the outer member. According to the present disclosure, it is possible to provide a packaging device that has an advantage in prevention of cargo shift.
Inventors:
YAMAZAKI MASAHIRO (JP)
NISHIOKA TOYOHIRO (JP)
NISHIOKA TOYOHIRO (JP)
Application Number:
PCT/JP2022/012236
Publication Date:
September 21, 2023
Filing Date:
March 17, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B65D85/68; B65D81/05
Foreign References:
| JPS62194589U | 1987-12-10 | |||
| JPS62146790U | 1987-09-16 | |||
| JPH03123885U | 1991-12-16 | |||
| JPH0343492U | 1991-04-23 |
Attorney, Agent or Firm:
TAKADA, TAKAHASHI & PARTNERS (JP)
Download PDF:
Previous Patent: SEMICONDUCTOR DEVICE
Next Patent: MONITORING SYSTEM, MONITORING DEVICE, MONITORING METHOD, AND RECORDING MEDIUM
Next Patent: MONITORING SYSTEM, MONITORING DEVICE, MONITORING METHOD, AND RECORDING MEDIUM