Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PACKAGING MATERIAL FOR WIRE ROD COIL
Document Type and Number:
WIPO Patent Application WO/2023/176991
Kind Code:
A1
Abstract:
The present invention relates to: a packaging material for a wire coil, the packaging material comprising a nonwoven fabric and a low-density polyethylene film; and a method for manufacturing same. The packaging material for the wire rod coil comprises: an outer polymer layer including ethylene vinyl acetate and low-density polyethylene; a non-woven fabric layer located below the outer polymer layer; and an inner polymer layer located under the non-woven fabric layer and containing ethylene vinyl acetate and low-density polyethylene. A polypropylene non-woven fabric having a basis weight of 20 g/m2 to 50 g/m2 is used for the non-woven fabric layer to protect the packaged product from impact, and the non-woven fabric layer is self-adhesive. The packaging material is useful due to using linear embossing, thus having the effect of preventing breakage in a certain direction.

Inventors:
KIM JONGYEOP (KR)
YEO GWANGSU (KR)
LIM MANBAE (KR)
PARK JEONGIN (KR)
SHIM CHANGBO (KR)
Application Number:
PCT/KR2022/003620
Publication Date:
September 21, 2023
Filing Date:
March 15, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LARK IND CO LTD (KR)
International Classes:
B65D65/42; B32B5/02; B32B7/12; B32B27/12; B65D85/04; C09J123/20; C09J167/00
Foreign References:
JP2002096414A2002-04-02
KR20180010507A2018-01-31
KR20190130742A2019-11-25
KR20180047805A2018-05-10
US4587175A1986-05-06
Attorney, Agent or Firm:
SANG-D HARMONY PATENT & LAW FIRM (KR)
Download PDF: