PACKAGING MATERIAL

WIPO Patent Application WO/2023/127594

A1

[Problem] The present invention enables the achievement of a packaging material which is configured from a resin species having a low environmental load, and has gas barrier properties and heat sealability required for packaging materials, while additionally having processing adequacy and the like that are necessary for packaging materials. [Solution] The present invention provides a packaging material which comprises one or more base material films that contain a polyolefin resin as a main constituent, and a heat sealable resin layer, and which is characterized in that: at least one of the base material films is a multilayer base material film that has a gas barrier layer; at least one base material film separated from the packaging material has a thermal elongation at 130°C of 6% or less in both the MD direction and the TD direction as measured by a thermomechanical analysis device; and the oxygen permeability of the packaging material in an environment at 23°C and 65% RH is 60 ml/m2∙d∙MPa or less.

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JP5883360	Laminated film compositions, packaging made from them, and usage
WO/2024/069245	FILM COMPRISING ETHYLENE COPOLYMERS OR TERPOLYMERS, METHOD FOR MAKING IT AND ITS USE AS SOLAR CELL ENCAPSULANT

YAMAZAKI ATSUSHI (JP)
IWATA DAISUKE (JP)
KASHIWA MITSUHIRO (JP)
YAMAGUCHI YUYA (JP)
IMAI TORU (JP)

PCT/JP2022/046838

July 06, 2023

December 20, 2022

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TOYO BOSEKI (JP)

B32B27/32; B65D65/40

WO2021210466A1

2021-10-21

JPH10329262A	1998-12-15
JP2007537058A	2007-12-20
JP2014069456A	2014-04-21
JP2023013250A	2023-01-26

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