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Title:
PACKAGING METHOD AND PACKAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2005/077764
Kind Code:
A1
Abstract:
A packaging method and a packaging device capable of safely packaging a packaged article without providing thermal damage to the packaged article, wherein the packaged article (2) is packaged by an upper packaging material (3) disposed on the upper surface side of the packaged article (2) and a lower packaging material (4) disposed on the lower surface side of the packaged article (2). The both packaging materials (3) and (4) are manufactured by using waved corrugated fiberboards formed of corrugated core sheets (3a) and (4a) in which corrugations are formed in a non-linear shape such as plane waveforms and flat-plate like surface materials (3b) and (4b) formed integrally with one surface side of the corrugated core sheets (3a) and (4a). Autohesive layers (5) allowing to provide adhesiveness only between adhesive layers are formed on the entire surfaces of the corrugated core sheets (3a) and (4a). The both packaging materials (3) and (4) are adhered to each other by applying pressure only to the end edge portions thereof.

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Inventors:
UTADA TAMAKI (JP)
OGATA KENZOU (JP)
NAKANISHI NOBORU (JP)
MURAKAMI JUNICHI (JP)
ARAI MASAKI (JP)
Application Number:
PCT/JP2004/007488
Publication Date:
August 25, 2005
Filing Date:
May 31, 2004
Export Citation:
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Assignee:
NIHON MATAI CO LTD (JP)
TACHIKAWA DANBORU KOGYO CO LTD (JP)
UTADA TAMAKI (JP)
OGATA KENZOU (JP)
NAKANISHI NOBORU (JP)
MURAKAMI JUNICHI (JP)
ARAI MASAKI (JP)
International Classes:
B65D27/00; B65B9/02; B65B9/06; B65B11/50; B65D65/14; B65D65/40; B65D75/30; (IPC1-7): B65B11/50; B65B9/02; B65B9/06; B65D65/14
Foreign References:
JP3058285U1999-06-18
JPH02114673U1990-09-13
JPH0687263U1994-12-22
JP2003118769A2003-04-23
JPS4937786A1974-04-08
JP2003340940A2003-12-02
JPS6258362U1987-04-10
Attorney, Agent or Firm:
Komatsu, Toshihiro (Yoyogi 2-chome Shibuya-ku, Tokyo53, JP)
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