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Title:
PAD CONDITIONER
Document Type and Number:
WIPO Patent Application WO/2024/019240
Kind Code:
A1
Abstract:
A pad conditioner for dressing the surface of a CMP pad according to an embodiment of the present invention comprises: a substrate; and a plurality of protrusion members provided on the substrate. Each of the protrusion members may include: a cutting part that cuts the pad, a roughness control part that supports the cutting part and limits the indentation depth of the cutting part; and a body part that protrudes from the substrate and supports the roughness control part.

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Inventors:
LEE SUNG GOO (KR)
Application Number:
PCT/KR2022/019465
Publication Date:
January 25, 2024
Filing Date:
December 02, 2022
Export Citation:
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Assignee:
SAESOL DIAMOND IND CO LTD (KR)
International Classes:
B24B53/017; B24B37/005; H01L21/67
Foreign References:
JP2007290109A2007-11-08
KR102229135B12021-03-18
JP2003305645A2003-10-28
JP2012121129A2012-06-28
US20080153398A12008-06-26
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
Download PDF:
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