Title:
PANEL AND PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2024/042750
Kind Code:
A1
Abstract:
This panel comprises: an insulative film; a molded resin that is formed integrally with the insulative film by injection molding; an electric circuit provided to the rear surface of the insulative film; and a flexible wiring substrate that has, at one end thereof, a connection part to be connected to a connection terminal of the electric circuit, and that is passed through the interior of the molded resin and is drawn outside from the back surface of the molded resin. The flexible wiring substrate has both surfaces thereof coated with an adhesive resin.
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Inventors:
NISHIMURO KENICHI (JP)
MAFUNE TAKAHITO (JP)
MAFUNE TAKAHITO (JP)
Application Number:
PCT/JP2023/008368
Publication Date:
February 29, 2024
Filing Date:
March 06, 2023
Export Citation:
Assignee:
ALPS ALPINE CO LTD (JP)
International Classes:
B29C45/14; B29C45/37; H01R13/405; H01R43/24; H05K3/00; H05K3/28
Foreign References:
JP2021068755A | 2021-04-30 | |||
JP2014035805A | 2014-02-24 | |||
JP2012011691A | 2012-01-19 | |||
CN104465548A | 2015-03-25 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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