PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE

Title:

PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2017/086455

Kind Code:

A1

Abstract:

Particles are provided which, in a connection portion that connects two members to be connected, can suppress the occurrence of cracking during a stress load. These particles are particles used to obtain a connecting material for forming the connection portion that connects two members to be connected. The particles are used in order to form a connection portion such that the thickness of the connection portion after connection exceeds twice the average particle diameter of the particles before connection, or, the particles have an average particle diameter of 0.1-15μm, the particles have a 10% K value greater than 3000 N/mm2 and less than or equal to 20000 N/mm2 and the particles have a particle diameter CV value of 50% or less.

Inventors:

YAMAGAMI MAI (JP)
HANEDA SATOSHI (JP)
WAKIYA TAKESHI (JP)
YAMADA YASUYUKI (JP)
UEDA SAORI (JP)
SASADAIRA MASAO (JP)

Application Number:

PCT/JP2016/084310

Publication Date:

May 26, 2017

Filing Date:

November 18, 2016

Export Citation:

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Assignee:

SEKISUI CHEMICAL CO LTD (JP)

International Classes:

C09J201/00; B22F1/18; B22F7/08; B23K35/24; C08F12/36; C08F16/32; C08F30/08; C08F36/08; C08J3/12; C09J9/02; C09J11/00; C09J11/08; H01B1/00; H01B1/22; H01B5/00; H01R11/01; B22F1/05; B22F1/052; B22F1/10

Domestic Patent References:

WO2009119788A1	2009-10-01
WO2012020799A1	2012-02-16

Foreign References:

JP2012209097A	2012-10-25
JP2014081928A	2014-05-08
JP2012064559A	2012-03-29
JP2012248531A	2012-12-13
JP2015176823A	2015-10-05
JP2015176824A	2015-10-05
JP2012216530A	2012-11-08
KR100667375B1	2007-01-10
JP2014029855A	2014-02-13
JP2016015256A	2016-01-28

Other References: