Title:
PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND RESIN COMPOSITION FOR PATTERN INVERSION
Document Type and Number:
WIPO Patent Application WO/2017/110658
Kind Code:
A1
Abstract:
The present invention provides a pattern formation method including the steps of: (a) applying to a substrate a coating of an actinic ray-sensitive or a radiation-sensitive resin composition containing a resin (A) the polarity of which increases by action of acid, and forming a first film; (b) exposing the first film to light; (c) patterning the exposed first film by development and forming a first pattern; (d) applying a coating of a resin composition for pattern inversion on the first pattern and forming a second film; and (e) patterning the second film by removing the first pattern using a treatment solution and forming a second pattern in which the shape of the first pattern is inverted. The resin composition for pattern inversion contains two or more kinds of resin, at least two of the kinds of resin differing from each other in speed of dissolution in the treatment solution.
Inventors:
FURUTANI HAJIME (JP)
Application Number:
PCT/JP2016/087455
Publication Date:
June 29, 2017
Filing Date:
December 15, 2016
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/40
Foreign References:
| JP2009217250A | 2009-09-24 | |||
| JP2011197628A | 2011-10-06 | |||
| JP2009301007A | 2009-12-24 | |||
| JP2009211036A | 2009-09-17 | |||
| JP2014157246A | 2014-08-28 |
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
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