Title:
PATTERN FORMING METHOD AND DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2010/030018
Kind Code:
A3
Abstract:
A pattern forming method includes coating, on a wafer W, a negative resist 3 and a positive resist 4 which has a higher sensitivity; exposing the positive resist 4 and the negative resist 3 on the wafer W with an image of a line-and-space pattern; and developing the positive resist 4 and the negative resist 3 in a direction parallel to a normal line of a surface of the wafer W. A fine pattern, which exceeds the resolution limit of an exposure apparatus, can be formed by using the lithography process without performing the overlay exposure.
Inventors:
SHIBAZAKI YUICHI (JP)
HIRUKAWA SHIGERU (JP)
HIRUKAWA SHIGERU (JP)
Application Number:
PCT/JP2009/065977
Publication Date:
May 06, 2010
Filing Date:
September 07, 2009
Export Citation:
Assignee:
NIPPON KOGAKU KK (JP)
SHIBAZAKI YUICHI (JP)
HIRUKAWA SHIGERU (JP)
SHIBAZAKI YUICHI (JP)
HIRUKAWA SHIGERU (JP)
International Classes:
G03F7/095
Foreign References:
| DE756886C | 1952-10-27 | |||
| DE675529C | 1939-05-11 | |||
| US4564583A | 1986-01-14 | |||
| US20030186547A1 | 2003-10-02 | |||
| US5922516A | 1999-07-13 | |||
| US20090219496A1 | 2009-09-03 |
Other References:
WIDMANN D, MADER H, FRIEDRICH H: "TECHNOLOGIE HOCHINTEGRIERTER SCHALTUNGEN", TECHNOLOGIE HOCHINTEGRIERTER SCHALTUNGEN, SPRINGER VERLAG, DE, 1 January 1996 (1996-01-01), pages 105 - 142, XP007910874, ISBN: 978-3-540-59357-7
Attorney, Agent or Firm:
KAWAKITA, Kijuro (5-4 Shinjuku 1-chome, Shinjuku-k, Tokyo 22, JP)
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