Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PHENOXY RESIN, COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING PHENOXY RESIN
Document Type and Number:
WIPO Patent Application WO/2023/100631
Kind Code:
A1
Abstract:
Provided is a phenoxy resin that has excellent flexibility, and is capable of suppressing warping caused by curing shrinkage and of obtaining a cured product having a self-repair function. A phenoxy resin including a structure represented by formula (1) below and a structure represented by formula (2) below. (In formula (1), R is a hydrocarbon group having 10 to 18 carbon atoms, and I is an integer of 1 to 10.) (In formula (2), X is a divalent linking group having 2 to 10 carbon atoms derived from hydrocarbon, R is a hydrocarbon group having 10 to 18 carbon atoms, and m is an integer of 1 to 10.)

Inventors:
TAKEDA AKIHIRO (JP)
HISANAGA YOSHIHIRO (JP)
YOKOYAMA YUKA (JP)
YASUI TATSUYA (JP)
Application Number:
PCT/JP2022/042223
Publication Date:
June 08, 2023
Filing Date:
November 14, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SAKATA INX CORP (JP)
International Classes:
C08F8/08; C08G59/14; C08G65/40
Foreign References:
JP2016527351A2016-09-08
CN112250836A2021-01-22
CN103554435A2014-02-05
CN111777740A2020-10-16
JP2016522851A2016-08-04
JP2015510958A2015-04-13
JP2010535152A2010-11-18
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
Download PDF: