Title:
PHOTOCURABLE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/178700
Kind Code:
A1
Abstract:
This invention relates to a photocurable adhesive composition comprising at least one first hydroxyl terminated epoxidized unsaturated polyolefin having an epoxide equivalent weight less than 250 g/eq; at least one second hydroxyl terminated epoxidized unsaturated polyolefin having an epoxide equivalent weight greater than or equal to 250 g/eq; at least one dimer acid modified epoxy resin; at least one core-shell toughening agent; at least one polyol component; and at least one cationic photoinitiator. The cured product of the photocurable adhesive composition of the present invention shows excellent acid resistance and elongation property and is therefore suitable to be used for the protection of glass edge during the glass slimming process.
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Inventors:
QI YALONG (CN)
LI BIN (CN)
CHU HONGYU (CN)
LI BIN (CN)
CHU HONGYU (CN)
Application Number:
PCT/CN2021/077601
Publication Date:
September 01, 2022
Filing Date:
February 24, 2021
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
HENKEL CHINA CO LTD (CN)
HENKEL CHINA CO LTD (CN)
International Classes:
C09J163/08; C08L63/00; C08L63/08; C09J163/00
Domestic Patent References:
| WO2019183753A1 | 2019-10-03 |
Foreign References:
| CN1148398A | 1997-04-23 | |||
| CN111511833A | 2020-08-07 | |||
| CN106459703A | 2017-02-22 | |||
| CN103756615A | 2014-04-30 | |||
| CN101553545A | 2009-10-07 | |||
| JPS63191880A | 1988-08-09 |
Attorney, Agent or Firm:
NTD PATENT & TRADEMARK AGENCY LIMITED (CN)
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