Title:
PHOTOCURABLE PASTE COMPOSITION AND FORMATION OF INORGANIC BURNED PATTERN THEREFROM
Document Type and Number:
WIPO Patent Application WO/2001/073511
Kind Code:
A1
Abstract:
A photocurable paste composition which comprises (A) fine inorganic particles, (B) a binder polymer having no ethylenically unsaturated double bonds, (C) one or more photocurable compounds, and (D) a photopolymerization initiator. The ingredient (B) is preferably used as a solution in at least one of the compounds (C). The compounds (C) preferably comprise a liquid monofunctional photocurable compound having one ethylenically unsaturated double bond per molecule and a polyfunctional photocurable compound having two or more ethylenically unsaturated double bonds per molecule. The composition is advantageously applicable to a technique in which an inorganic burned pattern, such as a partition wall pattern, electrode (conductor circuit) pattern, or dielectric (resistor) pattern, to be used in PDPs, FEDs, LCDs, or the like is formed while utilizing grooves (recessed parts) of a given pattern.
Inventors:
YANAGIDA NOBUYUKI (JP)
KOJIMA HIDEAKI (JP)
KOJIMA HIDEAKI (JP)
Application Number:
PCT/JP2001/002803
Publication Date:
October 04, 2001
Filing Date:
March 30, 2001
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
YANAGIDA NOBUYUKI (JP)
KOJIMA HIDEAKI (JP)
YANAGIDA NOBUYUKI (JP)
KOJIMA HIDEAKI (JP)
International Classes:
C08F2/50; C08F2/44; C08F291/00; G03F7/00; H01J9/24; H01J11/22; H01J11/34; H01J11/36; G03F7/027; G03F7/032; (IPC1-7): G03F7/033; C08F2/48; G03F7/004; G03F7/40; H01B1/22; H01J9/02
Foreign References:
| JPH10200239A | 1998-07-31 | |||
| JP2000056454A | 2000-02-25 | |||
| JPH11249300A | 1999-09-17 | |||
| JPH09134676A | 1997-05-20 |
Attorney, Agent or Firm:
Yoshida, Shigeki (Harada Bldg. 14-2 Takadanobaba 2-chome Shinjuku-ku, Tokyo, JP)
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