PHOTOCURABLE/THERMOSETTING RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM FORMED THEREFROM, AND METHOD OF FORMING PATTERN WITH THE SAME

Title:

PHOTOCURABLE/THERMOSETTING RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM FORMED THEREFROM, AND METHOD OF FORMING PATTERN WITH THE SAME

Document Type and Number:

WIPO Patent Application WO/2001/073510

Kind Code:

A1

Abstract:

A photocurable/thermosetting resin composition which comprises (A) a photosensitive prepolymer having both at least one carboxyl group and at least two ethylenically unsaturated double bonds per molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups per molecule, and (E) a curing accelerator. It is alkali-developable, and can be formulated so as to be of the one-pack type. This composition and a photosensitive dry film formed therefrom are useful as various resist materials and insulating materials, in particular, a solder resist for printed circuit boards, an interlayer dielectric for build-up multilayered printed circuit boards, etc.

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INDUSTRIAL APPLICABILITY Negative phosphate based on polyphenols and selected epoxy or vinyl ether compounds.

Inventors:

ONODERA SEIYA DI
NISHIKUBO TADATOMI (JP)
KAMEYAMA ATSUSHI (JP)
SASAKI MASAKI (JP)
KUSAMA MASATOSHI (JP)

Application Number:

PCT/JP2001/002590

Publication Date:

October 04, 2001

Filing Date:

March 28, 2001

Export Citation:

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Assignee:

UNIV KANAGAWA (JP)
TAIYO INK MFG CO LTD (JP)
ONODERA EIKO HF (JP)
NISHIKUBO TADATOMI (JP)
KAMEYAMA ATSUSHI (JP)
SASAKI MASAKI (JP)
KUSAMA MASATOSHI (JP)

International Classes:

C08F2/48; C08G65/18; G03F7/038; G03F7/004; H05K3/28; H05K3/46; (IPC1-7): G03F7/027; G03F7/004; C08F290/06; C08F299/02; C08F2/48; C08L63/10; H05K3/28; H05K3/46

Foreign References:

JPH07330865A	1995-12-19
JPH01203424A	1989-08-16
JPH1165116A	1999-03-05
JPH11322944A	1999-11-26

Other References: