Title:
PHOTOCURABLE SILICONE COMPOSITION, ADHESIVE, AND CURED SILICONE PRODUCT
Document Type and Number:
WIPO Patent Application WO/2021/229944
Kind Code:
A1
Abstract:
The present invention is a photocurable silicone composition characterized by containing: (A) an organopolysiloxane that has in the molecule thereof at least one specific structure including a (meth)acryl group; (B) an organohydrogenpolysiloxane that has in one molecule thereof at least two hydrogen atoms bonded to a silicon atom; (C) a photoradical polymerization initiator; and (D) a platinum group metal catalyst that is activated by light having a wavelength of 200-500 nm. Thus, provided is a photocurable silicone composition that has favorable storability, favorable surface curability in air, and favorable deep part curability, an adhesive that comprises said photocurable silicone composition, and a cured product of said photocurable silicone composition.
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Inventors:
KIMURA SHINJI (JP)
OZAI TOSHIYUKI (JP)
OZAI TOSHIYUKI (JP)
Application Number:
PCT/JP2021/013678
Publication Date:
November 18, 2021
Filing Date:
March 30, 2021
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C09J11/04; C08L83/05; C08L83/07; C09J11/06; C09J183/05; C09J183/07
Foreign References:
| US20190092951A1 | 2019-03-28 | |||
| JP2013203794A | 2013-10-07 | |||
| JP2016529342A | 2016-09-23 | |||
| JP2018076415A | 2018-05-17 | |||
| JP2019507205A | 2019-03-14 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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