Title:
PHOTOELECTRIC COMPOSITE TRANSMISSION MODULE
Document Type and Number:
WIPO Patent Application WO/2020/202982
Kind Code:
A1
Abstract:
This photoelectric composite transmission module 1 comprises: a photoelectric composite substrate 2 with an optical waveguide 6 and an electric circuit board 7 provided in order in the thickness direction; a printed wiring board 3 bonded to the electric circuit board 7 so as to be electrically connected to the electric circuit board 7; an optical element 4 which is optically connected to the optical waveguide 6 and is mounted to the photoelectric composite substrate 2 so as to be electrically connected to the electrical circuit board 7; and a bonding member 27 which covers the electrical connection portion 29 of the printed wiring board 3 and the electrical circuit board 7, and which bonds the printed wiring board 3 and the electrical circuit board 7. The bonding member 27 is a cured product of a material which can be cured by being heated at a temperature of 100°C for two hours.
Inventors:
SUZUKI KAZUAKI (JP)
KONEGAWA NAOTO (JP)
ODA TAKASHI (JP)
KONEGAWA NAOTO (JP)
ODA TAKASHI (JP)
Application Number:
PCT/JP2020/008879
Publication Date:
October 08, 2020
Filing Date:
March 03, 2020
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K1/02; G02B6/12; G02B6/42
Foreign References:
| JP2006351718A | 2006-12-28 | |||
| JP2014125631A | 2014-07-07 | |||
| US20050127528A1 | 2005-06-16 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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