Title:
PHOTOSENSITIVE COMPOSITION, TRANSFER FILM, LAMINATE MANUFACTURING METHOD, LAMINATE, SEMICONDUCTOR PACKAGE, AND RESIN
Document Type and Number:
WIPO Patent Application WO/2024/048296
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a photosensitive composition wherein photolithography properties are excellent and a cured film obtained therefrom has a low coefficient of linear expansion, as well as a transfer film, a laminate manufacturing method, a laminate, a semiconductor package, and a resin. A photosensitive composition according to the present invention includes: a resin A that includes at least one substance selected from the group consisting of a polyimide that has a carboxy group, a polybenzoxazole that has a carboxy group, a polyimide precursor that has a carboxy group, and a polybenzoxazole precursor that has a carboxy group; and a compound β that has a structure which, when exposed to light, reduces the quantity of carboxy groups in the resin A.
Inventors:
KODAMA KUNIHIKO (JP)
YAMAGUCHI KEIGO (JP)
YAMAGUCHI KEIGO (JP)
Application Number:
PCT/JP2023/029695
Publication Date:
March 07, 2024
Filing Date:
August 17, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/031; C08G73/10; G03F7/004; G03F7/037
Foreign References:
| JP2012189632A | 2012-10-04 | |||
| JP2001330962A | 2001-11-30 | |||
| JP2003015290A | 2003-01-15 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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