Title:
PHOTOSENSITIVE COMPOSITION, TRANSFER FILM, PATTERN FORMATION METHOD, PRODUCTION METHOD FOR CIRCUIT WIRING, AND PRODUCTION METHOD FOR TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2022/181431
Kind Code:
A1
Abstract:
The first problem to be addressed by the present invention is to provide a photosensitive composition that makes it possible to form a pattern that has excellent corrosion prevention performance in wet heat environments. The second problem to be addressed by the present invention is to provide a transfer film that is formed using the photosensitive composition. The third problem to be addressed by the present invention is to provide a pattern formation method, a production method for circuit wiring, and a production method for a touch panel. This photosensitive composition satisfies condition A1 and condition B1. Condition A1: The glass transition temperature of an exposed photosensitive layer obtained by means of procedure X is at least 65°C. Condition B1: The water content at 40°C and 90% RH of the exposed photosensitive layer obtained by means of procedure X is less than 2.0 mass%.
Inventors:
YAMAGUCHI KEIGO (JP)
KODAMA KUNIHIKO (JP)
KODAMA KUNIHIKO (JP)
Application Number:
PCT/JP2022/006314
Publication Date:
September 01, 2022
Filing Date:
February 17, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/26; G06F3/041; H05K3/06
Domestic Patent References:
| WO2015002071A1 | 2015-01-08 |
Foreign References:
| JP2010282067A | 2010-12-16 | |||
| JP2013061556A | 2013-04-04 | |||
| JP2011164304A | 2011-08-25 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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