Title:
PHOTOSENSITIVE MOLECULE AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/051686
Kind Code:
A1
Abstract:
Embodiments of the present application provide a photosensitive molecule, a photoacid generator containing the photosensitive molecule, and a photosensitive resin composition. The molecular structure of the photosensitive molecule comprises a main structure containing a naphthalene ring, a heterocyclic group X linked with the naphthalene ring in the main structure, and R2 linked with the heterocyclic group. R2 is selected from one of halogen, aryl, aralkyl, alkaryl, haloaryl, alkoxy aryl, epoxy alkyl, epoxy aryl, hydroxyalkyl, hydroxyaryl, hydroxyalkyl-substituted hydroxyaryl, aminoaryl, alkyl ether, aryl ether, epoxy alkoxy, epoxy alkoxy-substituted aryl, or alkoxysilane. According to the photosensitive molecule, the heterocyclic structure and a specific R2 group are introduced into the naphthalene ring, such that the pattern resolution of the photosensitive resin composition and the adhesion to interfaces such as copper and silicon can be effectively improved, the photosensitive molecule is endowed with multiple functions, and the formula of the resin composition is simplified.
Inventors:
LIU FULIN (CN)
ZHAO JIANZHANG (CN)
QIN DEJUN (CN)
WU QI (CN)
XU CHENGQIANG (CN)
ZHANG XUE (CN)
HU MENGYU (CN)
ZHAO JIANZHANG (CN)
QIN DEJUN (CN)
WU QI (CN)
XU CHENGQIANG (CN)
ZHANG XUE (CN)
HU MENGYU (CN)
Application Number:
PCT/CN2022/122570
Publication Date:
April 06, 2023
Filing Date:
September 29, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
UNIV DALIAN TECH (CN)
UNIV DALIAN TECH (CN)
International Classes:
C07D401/04; C09D7/63; G03F7/004
Foreign References:
| CN112552280A | 2021-03-26 | |||
| CN103995437A | 2014-08-20 | |||
| CN114516863A | 2022-05-20 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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