PHOTOSENSITIVE RESIN COMPOSITION, CURED ARTICLE, METHOD FOR MANUFACTURING CURED ARTICLE, ORGANIC EL DISPLAY DEVICE, AND DISPLAY DEVICE

WIPO Patent Application WO/2023/171284

A1

The present invention relates to a photosensitive resin composition that has high sensitivity and can form a low-transmittance film after curing irrespective of the heating atmosphere during curing. This photosensitive resin composition contains an alkali-soluble resin (a), an aromatic hydrocarbon (b) having at least one aromatic C–H bond and at least three phenolic hydroxyl groups per aromatic ring, a thermal cross-linking agent (c) having a partial structure represented by formula (1), and a photosensitive compound (e). (In formula (1), R10 represents a hydrogen atom or an alkyl group. Each * represents a bond, but no carbonyl group is adjacent to the nitrogen atom.)

JP2005014409	MAGAZINE FOR ROLLED PRINTING PLATE MATERIAL AND ROLLED PRINTING PLATE MATERIAL
JP2000512394	INDUSTRIAL APPLICABILITY: A method for reducing metal ions in an aminochromatic color-developing material and a method for using the same for synthesizing a bottom antireflection film material containing only a small amount of metal for a photoresist.
JPH06199770	NEW ONIUM SALT AND RADIATION SENSITIVE RESIN COMPOSITION CONTAINING THE SAME

KOMORI YUSUKE (JP)
NISHIOKA HIROKI (JP)

PCT/JP2023/005379

September 14, 2023

February 16, 2023

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TORAY INDUSTRIES (JP)

G03F7/004; C08G73/10; G03F7/023; G03F7/037; G09F9/30; H05B33/06; H05B33/10; H05B33/12; H05B33/22; H05B33/26; H10K50/00; H10K59/00

JP2021096353A	2021-06-24
JP2008033102A	2008-02-14
JP2003344998A	2003-12-03
JP2009009934A	2009-01-15

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