PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ORGANIC EL DISPLAY DEVICE, SEMICONDUCTOR ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

Title:

PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ORGANIC EL DISPLAY DEVICE, SEMICONDUCTOR ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2018/043250

Kind Code:

A1

Abstract:

Provided is a photosensitive resin composition which forms a cured film that exhibits excellent adhesion to a metal material, especially to copper even during heat treatments at low temperatures, while having a high degree of elongation. This photosensitive resin composition is characterized by containing (A) an alkali-soluble resin having a structural unit represented by general formula (1) and (B) a photo-crosslinking agent. (In general formula (1), each of X1 and X2 represents an organic group having a valence of 2-10; Y1 represents an organic group having a valence of 2-4; Y2 represents a divalent organic group having an aliphatic structure with 2 or more carbon atoms; each of R1 and R2 represents a hydrogen atom or an organic group having 1-20 carbon atoms; each of p, q, r, s and t represents an integer satisfying 0 ≤ p ≤ 4, 0 ≤ q ≤ 4, 0 ≤ r ≤ 2, 0 ≤ s ≤ 4 and 0 ≤ t ≤ 4; each of n1 and n2 represents an integer satisfying 1 ≤ n1 ≤ 500, 1 ≤ n2 ≤ 500 and 0.05 ≤ n1/(n1 + n2) < 1; and the repeating units may be arranged in blocks or randomly.)

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Inventors:

HAYASAKA MAKOTO (JP)
KIUCHI YOHEI (JP)
OKUDA RYOJI (JP)

Application Number:

PCT/JP2017/030144

Publication Date:

March 08, 2018

Filing Date:

August 23, 2017

Export Citation:

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Assignee:

TORAY INDUSTRIES (JP)

International Classes:

G03F7/037; C08G69/26; G03F7/004; G03F7/027; G03F7/075; G03F7/20

Domestic Patent References:

WO2014024951A1	2014-02-13
WO2007004569A1	2007-01-11
WO2015137281A1	2015-09-17
WO2011030744A1	2011-03-17
WO2015199219A1	2015-12-30

Foreign References:

JP2012212003A	2012-11-01
JP2009294536A	2009-12-17
JP2012133091A	2012-07-12
JP2010192867A	2010-09-02
JP2012069734A	2012-04-05

Attorney, Agent or Firm:

SEIRYU PATENT PROFESSIONAL CORPORATION et al. (JP)

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