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Title:
PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED FILM, PRINTED WIRING BOARD, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/188629
Kind Code:
A1
Abstract:
This photosensitive resin composition contains: (A) a polymer having a carboxyl group, and not having a (meta)acryloyl group; (C) a monomer with a molecular weight of less than 1000 not having a carboxyl group, and having a (meta)acryloyl group; (D) a compound with a molecular weight of 1000 or more not having a carboxyl group, and having a (meta)acryloyl group; (E) a polycyclic aromatic epoxy resin; and (F) a photopolymerization initiator. Although the photosensitive resin composition may contain (B) a compound having a carboxyl group and a (meta)acryloyl group, the content thereof is less than or equal to 10% by weight of total solids.

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Inventors:
KIDO MASAYOSHI (JP)
KOGISO TETSUYA (JP)
KODA TOMOHIRO (JP)
ASAHINA YUJI (JP)
Application Number:
PCT/JP2019/011618
Publication Date:
October 03, 2019
Filing Date:
March 19, 2019
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
G03F7/027; C08F299/02; G03F7/004; G03F7/032; H05K3/28
Domestic Patent References:
WO2015025925A12015-02-26
Foreign References:
JP2011099975A2011-05-19
JP2015067733A2015-04-13
JP2013080207A2013-05-02
JP2002040647A2002-02-06
JP2015197471A2015-11-09
JP2009237441A2009-10-15
US20170102610A12017-04-13
Attorney, Agent or Firm:
SHINTAKU, Masato (JP)
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