Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/215403
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition containing: (A) a silicone resin containing an acid-crosslinkable group; (B) an alicyclic epoxy compound represented by formula (B1) or (B2); and (C) a photo-acid-generating agent. (In the fomula, R11 through R46 are each independently a hydrogen atom or a C1-8 saturated hydrocarbyl group.)
Inventors:
MARUYAMA HITOSHI (JP)
HAYASHI KUMIKO (JP)
HAYASHI KUMIKO (JP)
Application Number:
PCT/JP2022/009437
Publication Date:
October 13, 2022
Filing Date:
March 04, 2022
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08G59/20; G03F7/004; G03F7/038; G03F7/075; G03F7/20
Foreign References:
| JP2007079481A | 2007-03-29 | |||
| JP2020002215A | 2020-01-09 | |||
| JP2019044150A | 2019-03-22 | |||
| JP2014142458A | 2014-08-07 | |||
| JP2017003707A | 2017-01-05 | |||
| JP2002088158A | 2002-03-27 | |||
| JP2008184571A | 2008-08-14 | |||
| US3220972A | 1965-11-30 | |||
| US3159601A | 1964-12-01 | |||
| US3159662A | 1964-12-01 | |||
| US3775452A | 1973-11-27 |
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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