PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING LIGHT SHIELDING LAYER, LIGHT SHIELDING LAYER AND COLOR FILTER

Title:

PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING LIGHT SHIELDING LAYER, LIGHT SHIELDING LAYER AND COLOR FILTER

Document Type and Number:

WIPO Patent Application WO/2006/090590

Kind Code:

A1

Abstract:

A photosensitive resin composition for forming a light shielding layer is a photosensitive resin composition for forming a light shielding layer with a film thickness of more than 2 µm, comprising (A) a light shielding pigment, (B) an alkali soluble resin, (C) a photopolymerizable compound and (D) a photopolymerization initiator, and is characterized in that the (A) light shielding pigment comprises a perylene black pigment.

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Inventors:

OHNISHI HIROYUKI (JP)
MARUYAMA KENJI (JP)
UCHIKAWA KIYOSHI (JP)

Application Number:

PCT/JP2006/302234

Publication Date:

August 31, 2006

Filing Date:

February 09, 2006

Export Citation:

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Assignee:

TOKYO OHKA KOGYO CO LTD (JP)
OHNISHI HIROYUKI (JP)
MARUYAMA KENJI (JP)
UCHIKAWA KIYOSHI (JP)

International Classes:

G03F7/004; G02B5/20

Foreign References:

JP2003139938A	2003-05-14
JP2003105226A	2003-04-09
JP2004346218A	2004-12-09
JP2004347916A	2004-12-09

Attorney, Agent or Firm:

Tanai, Sumio (Yaesu Chuo-k, Tokyo 53, JP)

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