Title:
POSITIVE-WORKING RESIST COMPOSITION, METHOD FOR RESIST PATTERN FORMATION AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2006/090591
Kind Code:
A1
Abstract:
This invention provides a positive-working resist composition containing an acid dissociative dissolution inhibitor group and comprising a base material component (A), which increases its own alkali solubility through the action of an acid and an acid generating agent component (B), which generates an acid upon exposure. The base material component (A) contains a compound (A1) comprising a polyhydric phenol compound represented by general formula (I) containing two or more phenolic hydroxyl groups and having a molecular weight of 300 to 2500 in which a part or the whole of the phenolic hydroxyl groups is protected by an acid dissociative dissolution inhibitor group (II) represented by general formula (II).
Inventors:
SHIONO DAIJU (JP)
HIRAYAMA TAKU (JP)
HADA HIDEO (JP)
HIRAYAMA TAKU (JP)
HADA HIDEO (JP)
Application Number:
PCT/JP2006/302271
Publication Date:
August 31, 2006
Filing Date:
February 09, 2006
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
SHIONO DAIJU (JP)
HIRAYAMA TAKU (JP)
HADA HIDEO (JP)
SHIONO DAIJU (JP)
HIRAYAMA TAKU (JP)
HADA HIDEO (JP)
International Classes:
G03F7/039; G03F7/004; H01L21/027
Foreign References:
| JPH06266109A | 1994-09-22 | |||
| JPH11167199A | 1999-06-22 | |||
| JPH10274845A | 1998-10-13 | |||
| JPH09211866A | 1997-08-15 |
Attorney, Agent or Firm:
Tanai, Sumio (Yaesu Chuo-ku, Tokyo 53, JP)
Download PDF: