Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED SHAPED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/176868
Kind Code:
A1
Abstract:
The present invention provides a photosensitive resin composition which contains a polymer (A) that has an acid-cleavable group, a photoacid generator (B) and a solvent (C), wherein: the polymer (A) comprises a structural unit (I) that is represented by formula (1) and a structural unit (III) that has a glass transition temperature Tg of 50°C or less in the form of a homopolymer; and the photoacid generator (B) is a compound which generates an acid that has a van der Waals volume of 200 Å3 or more when irradiated with active light or radiation. The present invention also provides: a method for forming a resist pattern film, the method using this photosensitive resin composition; and a method for producing a plated shaped article. The details of R1A and L in formula (1) are as described in the description.
Inventors:
NISHIGUCHI NAOKI (JP)
TSUYUKI RYOUTA (JP)
MATSUMOTO TOMOYUKI (JP)
ISHII AKIRA (JP)
ITO ATSUSHI (JP)
HIGUCHI TETSUYA (JP)
TSUYUKI RYOUTA (JP)
MATSUMOTO TOMOYUKI (JP)
ISHII AKIRA (JP)
ITO ATSUSHI (JP)
HIGUCHI TETSUYA (JP)
Application Number:
PCT/JP2023/009992
Publication Date:
September 21, 2023
Filing Date:
March 15, 2023
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
G03F7/039; C08F220/02; C09K3/00; G03F7/004
Foreign References:
| JP2022042954A | 2022-03-15 | |||
| JP2020055797A | 2020-04-09 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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