Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MAGNETOSTRICTIVE MATERIAL, ENERGY CONVERSION MEMBER, METHOD FOR MANUFACTURING SAME, AND VIBRATION POWER GENERATOR
Document Type and Number:
WIPO Patent Application WO/2023/176869
Kind Code:
A1
Abstract:
[Problem] To provide a magnetostrictive material, an energy conversion member, a method for manufacturing same, and a vibration power generator, wherein good energy efficiency is achieved, and manufacturing costs can be reduced. [Solution] A magnetostrictive material has voids. A plate-like magnetostrictive material has through holes in the plate thickness direction. The plate-like magnetostrictive material, which has through holes in the plate thickness direction, and a plate member are laminated in the plate thickness direction to form an energy conversion member. The plate-like magnetostrictive material has a honeycomb structure in which cells constitute through holes. The cells in the honeycomb structure have polygonal-shaped cross-sections. The plate member is made of a magnetostrictive material, a soft magnetic material, or a non-magnetic material. The plate-like magnetostrictive material and/or the plate member are made up of a plurality of pieces and are laminated in the plate thickness direction.

Inventors:
KURITA HIROKI (JP)
NARITA FUMIO (JP)
WATANABE MASAHITO (JP)
URAKAWA KIYOSHI (JP)
SATO TAKENOBU (JP)
SASA TATSURO (JP)
CHIBA DAIKI (JP)
HIROTANI MASUMI (JP)
OWARI NAOYUKI (JP)
TAYAMA TSUYOKI (JP)
EBATA TAKASHI (JP)
Application Number:
PCT/JP2023/009997
Publication Date:
September 21, 2023
Filing Date:
March 15, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
UNIV TOHOKU (JP)
TOHOKU STEEL CO LTD (JP)
International Classes:
H10N35/85; H02N2/18; H10N30/20; H10N30/30
Foreign References:
CN106825542A2017-06-13
JPH06224485A1994-08-12
JPH0983037A1997-03-28
JP2014033508A2014-02-20
KR20210156584A2021-12-27
JP2021025980A2021-02-22
JP2008507142A2008-03-06
CN104201279A2014-12-10
Attorney, Agent or Firm:
SUDA Atsushi (JP)
Download PDF: