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Title:
PHOTOSENSITIVE RESIN COMPOSITION, POLYMERIC PRECURSOR, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/221457
Kind Code:
A1
Abstract:
Provided are: a photosensitive resin composition that has, when being formed into a cured film, high breaking elongation and provides excellent storage stability; a polymeric precursor; a cured film; a laminate; a cured film production method; and a semiconductor device. This photosensitive resin composition comprises: a polymeric precursor selected from polyimide precursors and polybenzoxazole precursors; a photoradical polymerization initiator; and a solvent, wherein the acid value of acid radicals that have a neutral point pH of 7.0-12.0 and that are included in the polymeric precursor falls within a range of 2.5-34.0 mgKOH/g, and the polymeric precursor has a radically polymerizable group or the photosensitive resin composition contains a radically polymerizable compound other than the polymeric precursor.

Inventors:
KAWABATA TAKESHI (JP)
YOSHIDA KENTA (JP)
IWAI YU (JP)
SHIBUYA AKINORI (JP)
Application Number:
PCT/JP2018/020369
Publication Date:
December 06, 2018
Filing Date:
May 28, 2018
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F2/44; G03F7/027; C08F2/50; C08F283/04; C08G73/06; G03F7/004; G03F7/037; G03F7/20; G03F7/32; C08F20/00
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Attorney, Agent or Firm:
SIKS & CO. (JP)
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