Title:
PHOTOSENSITIVE RESIN COMPOSITION FOR SANDBLASTING USE AND PHOTOSENSITIVE FILM FOR SANDBLASTING USE
Document Type and Number:
WIPO Patent Application WO/2021/246382
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a photosensitive resin composition for sandblasting use, which is less likely to become cloudy and has satisfactory developability; and a photosensitive film. The problem can be solved by: a photosensitive resin composition for sandblasting use, which comprises (A) an alkali-soluble resin, (B) a photopolymerization initiator, (C) a urethane (meth)acrylate and (D) an acid-modified epoxy (meth)acrylate, in which (E) an alicyclic (meth)acrylate is further contained or the (A) alkali-soluble resin is a copolymer produced by copolymerizing (i) a styrene derivative, (ii) acrylic acid and (iv) a monomer that has an ethylenically unsaturated group and is different from a styrene derivative and acrylic acid; and a photosensitive film which has a photosensitive resin layer comprising the photosensitive resin composition.
Inventors:
ITO NOBORU (JP)
IRISAWA MUNETOSHI (JP)
IRISAWA MUNETOSHI (JP)
Application Number:
PCT/JP2021/020775
Publication Date:
December 09, 2021
Filing Date:
June 01, 2021
Export Citation:
Assignee:
MITSUBISHI PAPER MILLS LTD (JP)
International Classes:
C08F251/02; C08F212/08; C08F220/06; C08F220/10; C08F265/04; C08F290/06; C08F299/02; C08G18/64; G03F7/004; G03F7/027; G03F7/033; G03F7/11
Domestic Patent References:
| WO2019189151A1 | 2019-10-03 |
Foreign References:
| JP2016155978A | 2016-09-01 | |||
| JP2007178459A | 2007-07-12 | |||
| JP2017126053A | 2017-07-20 |
Attorney, Agent or Firm:
TAKAHASHI INTERNATIONAL PATENT OFFICE (JP)
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