Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE SHEET, CURED FILM, METHOD FOR PRODUCING CURED FILM, INTERLAYER INSULATING FILM AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/020344
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a photosensitive resin composition which has good pattern formability, and which enables the achievement of a cured film having a low dielectric constant, a low dielectric loss tangent and high elongatability, said cured film being obtained by curing this photosensitive resin composition. The present invention is a photosensitive resin composition which contains (A) a polyimide precursor and (B) a photopolymerization initiator, wherein: the polyimide precursor (A) contains a polyvalent carboxylic acid residue and/or a polyvalent amine residue having a structure of an alicyclic hydrocarbon having 4 to 8 carbon atoms, said hydrocarbon optionally having an unsaturated bond; and at least four hydrogen atoms in the structure of an alicyclic hydrocarbon are substituted by a hydrocarbon group having 4 to 12 carbon atoms, said hydrocarbon group optionally having an unsaturated bond.
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Inventors:
ARAKI HITOSHI (JP)
OGASAWARA HISASHI (JP)
JUKEI MASAYA (JP)
TOMIKAWA MASAO (JP)
OGASAWARA HISASHI (JP)
JUKEI MASAYA (JP)
TOMIKAWA MASAO (JP)
Application Number:
PCT/JP2020/028701
Publication Date:
February 04, 2021
Filing Date:
July 27, 2020
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G73/10; G03F7/004; G03F7/027; G03F7/20
Domestic Patent References:
| WO2017030070A1 | 2017-02-23 |
Foreign References:
| JPH06282071A | 1994-10-07 | |||
| US20150344627A1 | 2015-12-03 | |||
| JP2019031597A | 2019-02-28 | |||
| JP2020029504A | 2020-02-27 |
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