Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/043041
Kind Code:
A1
Abstract:
The present invention relates to a liquid-phase photosensitive resin composition with excellent developability and deep-part curability.

Inventors:
KIM CHANG HYEOK (KR)
HONG SEUNG MIN (KR)
HA MYONG SIK (KR)
CHOI HYUNG OUK (KR)
Application Number:
PCT/KR2022/010830
Publication Date:
March 23, 2023
Filing Date:
July 22, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KCC CORP (KR)
International Classes:
G03F7/004; C08F2/50; C08F220/34; C08F283/10; C08F290/06; G03F7/032; H05K3/28
Foreign References:
KR20110036749A2011-04-08
KR20150106386A2015-09-21
JPH05239426A1993-09-17
KR20100002574A2010-01-07
KR20030097780A2003-12-31
Attorney, Agent or Firm:
SUNGAM SUH INTERNATIONAL PATENT & LAW FIRM (KR)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: NOVEL COMPOUND FOR LIGHT-EMITTING DEVICE, AND ORGANIC LIGHT-EMITTING DEVICE COMPRISING SAME

Next Patent: PLASMA UNIFORMITY CONTROL SYSTEM USING MULTI-PULSING AND CONTROL METHOD THEREOF