Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/233896
Kind Code:
A1
Abstract:
Provided are: a photosensitive resin composition that provides a polyimide resin with a low dielectric loss tangent and that has excellent stability during storage; a patterned resin membrane using the photosensitive resin composition; and a method for producing a patterned polyimide resin membrane by using the photosensitive resin composition. This photosensitive resin composition comprises: a polyimide resin precursor (A) derived from a dicarboxylic acid compound that has an unsaturated group including a carbon-carbon double bond, and a diamine compound that has, in a side chain, an aromatic group and/or a diamine compound that has a 4,4'-dioxybiphenyl skeleton; a photo-radical polymerization initiator (C); and an organic solvent (S). A certain amount of a urea-based solvent (S1) is used as the organic solvent (S).
Inventors:
EBISAWA KAZUAKI (JP)
Application Number:
PCT/JP2023/016824
Publication Date:
December 07, 2023
Filing Date:
April 28, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/027; C08G73/10; C08G73/12; C08G75/045; G03F7/004; G03F7/20
Domestic Patent References:
| WO2014104090A1 | 2014-07-03 |
Foreign References:
| JP2022073127A | 2022-05-17 | |||
| JP2009155433A | 2009-07-16 | |||
| JP2011059656A | 2011-03-24 | |||
| JP2014157310A | 2014-08-28 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
Download PDF:
Previous Patent: POLYIMIDE RESIN PRECURSOR
Next Patent: TEMPERATURE IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME
Next Patent: TEMPERATURE IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME