Title:
POLYIMIDE RESIN PRECURSOR
Document Type and Number:
WIPO Patent Application WO/2023/233895
Kind Code:
A1
Abstract:
Provided are a polyimide resin precursor that yields a polyimide resin having a low dielectric loss tangent and yields a photosensitive resin composition having exceptional photolithography properties, a photosensitive resin composition including the polyimide resin precursor as a polymerizable resin (A), a patterned resin film in which the photosensitive resin composition is used, and a method for producing a patterned polyimide resin film. A polyimide resin precursor having, in a side chain, a C3-30 unsaturated group G1 that is free of (meth)acryloyl groups and has one or more ethylenically unsaturated double bonds, and optionally having, in a side chain, a (meth)acryloyl-group-containing group G2, wherein the number of mol of the unsaturated group G1 and the number of mol of the (meth)acryloyl-group-containing group G2 in the side chains are each within a prescribed range.
Inventors:
EBISAWA KAZUAKI (JP)
IRIE MAKIKO (JP)
IRIE MAKIKO (JP)
Application Number:
PCT/JP2023/016823
Publication Date:
December 07, 2023
Filing Date:
April 28, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
C08G73/12; C08G73/10; G03F7/027; G03F7/20
Domestic Patent References:
| WO2022045120A1 | 2022-03-03 |
Foreign References:
| JPH07238168A | 1995-09-12 | |||
| JPH07242744A | 1995-09-19 | |||
| JPH0680776A | 1994-03-22 | |||
| JPH06102667A | 1994-04-15 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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