Title:
PHOTOSENSITIVE RESIN SHEET, CURED FILM, AND MULTILAYER WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/153390
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a photosensitive resin sheet in which the cross-sectional shape of a pattern is rectangular, a fine pattern can be formed and a pattern defect part can be identified easily, and through which a metal wiring in an underlayer part cannot be seen. Provided is a photosensitive resin sheet comprising a support film and a photosensitive resin layer, the photosensitive resin sheet being characterized in that the photosensitive resin layer is formed from a photosensitive resin composition, the photosensitive resin composition comprises an alkali-soluble polyimide (A), a photopolymerizable compound (B), a photopolymerization initiator (C) and a coloring material (D), the photosensitive resin layer satisfies the below-mentioned relationship A wherein Tb600 represents a transmittance at 600 nm and TbVL represents a minimum value among transmittances in a wavelength range from 500 to 800 nm.
Relationship A: at least one of formulae 1 and 2 is satisfied. Formula 1: 0.10% ≤ Tb600 ≤ 40%
Formula 2: 0.10% ≤ TbVL ≤ 40%
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Inventors:
HAMANO TSUBASA (JP)
KOMORI YUSUKE (JP)
KOMORI YUSUKE (JP)
Application Number:
PCT/JP2023/003951
Publication Date:
August 17, 2023
Filing Date:
February 07, 2023
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/004; C08F2/44; C08G73/10; G03F7/037; H05K1/03
Domestic Patent References:
| WO2010087238A1 | 2010-08-05 |
Foreign References:
| JP2020112685A | 2020-07-27 | |||
| JP2020148815A | 2020-09-17 | |||
| JP2016180929A | 2016-10-13 | |||
| JP2021081751A | 2021-05-27 | |||
| JP2021042268A | 2021-03-18 | |||
| US20210109443A1 | 2021-04-15 |
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