PHOTOSENSITIVE TRANSFER MATERIAL, CIRCUIT WIRING MANUFACTURING METHOD, AND TOUCH PANEL MANUFACTURING METHOD

Title:

PHOTOSENSITIVE TRANSFER MATERIAL, CIRCUIT WIRING MANUFACTURING METHOD, AND TOUCH PANEL MANUFACTURING METHOD

Document Type and Number:

WIPO Patent Application WO/2019/225460

Kind Code:

A1

Abstract:

Provided is a photosensitive transfer material comprising a temporary support and a photosensitive resin layer that includes a polymer having a glass transition temperature of 90°C or lower and including a structural unit having an acid group protected by an acid-decomposable group, a photoacid generator, and a benzotriazole compound. Provided also is the application of the photosensitive transfer material.

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Inventors:

MOROZUMI KAZUMASA (JP)
SASATA KATSUMI (JP)
KANNA SHINICHI (JP)
MATSUDA TOMOKI (JP)
ISHIZAKA SOJI (JP)

Application Number:

PCT/JP2019/019460

Publication Date:

November 28, 2019

Filing Date:

May 16, 2019

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

G03F7/004; C08F20/26; G03F7/039; G03F7/20; G06F3/041; H05K3/06

Foreign References:

JP2004347951A	2004-12-09
JP2017032983A	2017-02-09
JP2018031847A	2018-03-01
JP2017156735A	2017-09-07

Attorney, Agent or Firm:

TAIYO, NAKAJIMA & KATO (JP)

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