Title:
PHOTOSENSITIVE TRANSFER MATERIAL, AND PRODUCTION METHOD FOR CIRCUIT WIRING
Document Type and Number:
WIPO Patent Application WO/2021/176812
Kind Code:
A1
Abstract:
The present disclosure provides a photosensitive transfer material that has a temporary-support body and a photosensitive resin layer which includes an alkali soluble polymer, an ethylenically unsaturated bond–containing compound, and a photoinitiator, the ratio of the amount of a phenolic compound with a molecular mass of no more than 300 in the photosensitive resin layer being no higher than 300 ppm relative to the total mass of the photosensitive resin layer. The present disclosure also provides a use for the photosensitive transfer material.
Inventors:
MATSUDA TOMOKI (JP)
Application Number:
PCT/JP2020/048055
Publication Date:
September 10, 2021
Filing Date:
December 22, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/027; G03F7/40; H05K3/06
Domestic Patent References:
| WO2009133817A1 | 2009-11-05 | |||
| WO2009147913A1 | 2009-12-10 |
Foreign References:
| JP2007093796A | 2007-04-12 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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