PHOTOSENSITIVE TRANSFER MATERIAL, RESIN PATTERN PRODUCTION METHOD, CIRCUIT WIRING PRODUCTION METHOD, TOUCH PANEL PRODUCTION METHOD, AND, FILM AND PRODUCTION METHOD THEREFOR

WIPO Patent Application WO/2020/158316

A1

This photosensitive transfer material comprises a temporary support and a photosensitive resin layer provided on the temporary support, wherein: the temporary support has a particle-containing layer containing particles; the surface roughness on the surface of the temporary support facing away from the surface on the side having the photosensitive resin layer is 0.02 μm to 0.20 μm; and the photosensitive resin layer contains a photoacid generator, and a polymer containing a constituent unit having an acid group protected by an acid decomposable group. Also provided are: a resin pattern production method, a circuit wiring production method, and a touch panel production method, which use the transfer material; and a film having a particle-containing layer, a haze value of 0.2% or less, and a surface roughness Ra on the surface of the side having the particle-containing layer of 0.02 μm to 0.20 μm, as well as a production method therefor.

MOROZUMI KAZUMASA (JP)
TESHIMA YUKI (JP)
KANNA SHINICHI (JP)
MIYAKE KAZUHITO (JP)

PCT/JP2020/000277

August 06, 2020

January 08, 2020

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FUJIFILM CORP (JP)

B32B27/18; B32B7/06; B32B27/36; C08F20/28; G03F7/004; G03F7/039; G03F7/09; G03F7/11; G06F3/041; H05K3/06

WO2018062074A1

2018-04-05

JP2013029822A	2013-02-07
JPH09220791A	1997-08-26

TAIYO, NAKAJIMA & KATO (JP)

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