Title:
PIEZOELECTRIC OSCILLATOR
Document Type and Number:
WIPO Patent Application WO/1996/001524
Kind Code:
A1
Abstract:
A resin-molded piezoelectric oscillator integrally comprising an encased piezoelectric device such as a quartz oscillator or a SAW resonator and an IC chip such as a PLL IC electrically connected to the oscillator. A lead for heat radiation is extended from an island of a lead frame on which the IC chip is disposed, and part of the lead is exposed from the mold resin so as to positively remove heat generated in the IC chip. A lead for heat radiation is also fitted to the case of the oscillator and is extended outside through the mold resin so as to remove heat transferred to the case and to prevent thermal influences on the piezoelectric device inside the case. In oscillators for which reduction of the size and the higher frequency are required, the temperature rise inside the oscillator is restricted by removing the heat generated inside the IC chip to the outside of the mold resin, and the oscillator can have high reliability for a long time and can cope with a higher frequency.
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Inventors:
KIKUSHIMA MASAYUKI (JP)
Application Number:
PCT/JP1995/000801
Publication Date:
January 18, 1996
Filing Date:
April 24, 1995
Export Citation:
Assignee:
SEIKO EPSON CORP (JP)
KIKUSHIMA MASAYUKI (JP)
KIKUSHIMA MASAYUKI (JP)
International Classes:
H03H9/05; H03H9/08; H03H9/10; H03L1/04; H03L7/183; (IPC1-7): H03B5/32; H03H9/02; H01L23/28
Foreign References:
| JPH04225268A | 1992-08-14 | |||
| JPH01184941A | 1989-07-24 | |||
| JPS6324841U | 1988-02-18 | |||
| JPS54168166U | 1979-11-27 | |||
| JP63263902U | ||||
| JPH04294624A | 1992-10-19 | |||
| JPH043609A | 1992-01-08 | |||
| JPH01146549U | 1989-10-09 | |||
| JPH0170420U | 1989-05-10 | |||
| JPH07122937A | 1995-05-12 |
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