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Patent Searching and Data


Title:
PLANT-BASED BOARD PRODUCTION METHOD AND PLANT-BASED BOARD
Document Type and Number:
WIPO Patent Application WO/2016/056207
Kind Code:
A1
Abstract:
Provided is a plant-based board production method in which an adhesive and a plurality of plant pieces having a lignin content of 15-20 wt% and a density of 0.15-0.20 g/cm3 are subjected to hot press molding and the curing of the adhesive causes the plurality of plant pieces to adhere to one another.

Inventors:
SUGAWARA RYO
Application Number:
PCT/JP2015/004997
Publication Date:
April 14, 2016
Filing Date:
October 01, 2015
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B27N3/02; B32B21/02
Domestic Patent References:
WO1996019328A11996-06-27
Foreign References:
JP2000246709A2000-09-12
JP2007021972A2007-02-01
JPH07232309A1995-09-05
JP2011224950A2011-11-10
JP2008260238A2008-10-30
JP2005096143A2005-04-14
Attorney, Agent or Firm:
FUJII, Kentaro et al. (JP)
Fujii Kentaro (JP)
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