Title:
PLASMA PROCESSING DEVICE, ANALYSIS DEVICE, PLASMA PROCESSING METHOD, ANALYSIS METHOD, PLASMA PROCESSING PROGRAM, AND ANALYSIS PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/140215
Kind Code:
A1
Abstract:
The present invention searches, in a shorter time period, a plasma generation high frequency for a frequency which minimizes the power of a reflection wave that is reflected from a processing space. The plasma processing device comprises an inference unit which infers a setting frequency of the plasma generation high frequency by inputting a processing condition during plasma processing to a trained model that has been trained by using training data that includes setting frequencies searched by changing the setting frequency of the plasma generation high frequency and minimizing the power of a reflection wave reflected from a processing space, and includes the processing conditions corresponding to the corresponding setting frequencies, when the plasma processing is performed in each of a plurality of processing conditions.
Inventors:
KANEKO KAZUSHI (JP)
Application Number:
PCT/JP2023/000959
Publication Date:
July 27, 2023
Filing Date:
January 16, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H05H1/46
Foreign References:
| JP2016100312A | 2016-05-30 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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