Title:
PLASMA PROCESSING DEVICE AND PLASMA CONTROL METHOD
Document Type and Number:
WIPO Patent Application WO/2023/032725
Kind Code:
A1
Abstract:
This plasma processing device comprises: a processing vessel; an electromagnetic wave generator; and a resonator array structure. The processing vessel provides a processing space.
The electromagnetic wave generator generates electromagnetic waves which are for exciting plasma supplied to the processing space. The resonator array structure is located in the processing vessel and is formed by arraying a plurality of resonators which can resonate with a magnetic field component of electromagnetic waves and the sizes of which are smaller than the wavelengths of the electromagnetic waves.
Inventors:
OOWADA SHIN (JP)
KANEKO KAZUSHI (JP)
MATSUKUMA MASAAKI (JP)
KAMATA EIKI (JP)
KAWAKAMI SATORU (JP)
IKEDA TARO (JP)
SAKAI OSAMU (JP)
KANEKO KAZUSHI (JP)
MATSUKUMA MASAAKI (JP)
KAMATA EIKI (JP)
KAWAKAMI SATORU (JP)
IKEDA TARO (JP)
SAKAI OSAMU (JP)
Application Number:
PCT/JP2022/031485
Publication Date:
March 09, 2023
Filing Date:
August 22, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
THE UNIV OF SHIGA PREFECTURE (JP)
THE UNIV OF SHIGA PREFECTURE (JP)
International Classes:
H05H1/46
Foreign References:
| JP2017147129A | 2017-08-24 | |||
| JP2006245600A | 2006-09-14 | |||
| JP2006185923A | 2006-07-13 | |||
| JP2005082849A | 2005-03-31 | |||
| JP2003188152A | 2003-07-04 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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