Title:
PLASMA PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/151147
Kind Code:
A1
Abstract:
This plasma etching device (1) is provided with a processing chamber (2), an evacuation mechanism (30), and the like. The processing chamber (2) comprises the following: a first chamber (2a) containing a plasma generation unit (3); a second chamber (2b), a top region of which contains a processing unit (4) and a bottom region of which contains an evacuation unit (5); and a third chamber (2c) containing a manifold unit (6). The evacuation mechanism (30) has a vacuum pump (31) connected to an opening (8) in the third chamber (2c). The effective cross-sectional area (S1) of the manifold unit (6) is larger than the area (S3) of the opening (8) in the third chamber (2c), the effective cross-sectional area (S2) of the exhaust unit (5) is larger than the effective cross-sectional area (S1) of the manifold unit (6), the thickness (L3) of the section of the third chamber (2c) where the aforementioned opening (8) is formed is greater than the length (L1) of the manifold unit (6), and the height (L2) of the exhaust unit (5) is greater than the length (L1) of the manifold unit (6).
Inventors:
HAYAMI TOSHIHIRO (JP)
TOMISAKA KENICHI (JP)
TOMISAKA KENICHI (JP)
Application Number:
PCT/JP2014/059423
Publication Date:
October 08, 2015
Filing Date:
March 31, 2014
Export Citation:
Assignee:
SPP TECHNOLOGIES CO LTD (JP)
International Classes:
H01L21/3065; B01J3/03; H01L21/205; H05H1/46
Foreign References:
| JP2003249489A | 2003-09-05 | |||
| JP2006303309A | 2006-11-02 | |||
| JP2001185542A | 2001-07-06 | |||
| JPS57204118A | 1982-12-14 |
Attorney, Agent or Firm:
MURAKAMI, SATOSHI (JP)
Tomoji Murakami (JP)
Tomoji Murakami (JP)
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