Title:
PLASTIC POLISHING PROCESS UNDER UNIFORM PRESSURE
Document Type and Number:
WIPO Patent Application WO/2000/027586
Kind Code:
A1
Abstract:
The present invention relates to a plastic polishing process under uniform pressure for polishing workpieces, including steps of: disposing the workpieces to be polished, polishing liquid and abrasive grains in a container in which hydraulic pressure can be increased and ultrasonic vibration can be produced; increasing the hydraulic pressure of the polishing liquid in the said container to a certain value by applying Pascal principle, for enabling the high pressure polishing liquid and abrasive grains to be applied to the workpieces with uniform high pressure in all directions; decreasing the stress and tension of the workpieces to be polished by Blaha effect and Cavitation effect due to the ultrasonic vibration produced in the said container; polishing the workpieces with uniform pressure in all directions and to the whole surface thereof.
Inventors:
TSENG SHAOCHIEN (CN)
Application Number:
PCT/CN1998/000265
Publication Date:
May 18, 2000
Filing Date:
November 06, 1998
Export Citation:
Assignee:
TSENG SHAOCHIEN (CN)
International Classes:
B24B1/04; B24B31/06; (IPC1-7): B24B1/04; B24B31/06
Foreign References:
| US3589071A | 1971-06-29 | |||
| US2591083A | 1952-04-01 | |||
| EP0608730A1 | 1994-08-03 | |||
| US5384989A | 1995-01-31 | |||
| US3535159A | 1970-10-20 | |||
| US3248826A | 1966-05-03 |
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE (435 Guiping Road Shanghai 3, CN)
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