Title:
PLATE MATERIAL PROCESSING DEVICE, PRESSING MOLD, AND PRESSING MOLD INSTALLATION BODY
Document Type and Number:
WIPO Patent Application WO/2013/065781
Kind Code:
A1
Abstract:
A plate material processing device (301) is provided with a pressurizing unit (305) for pressurizing a plate material (W), and a receiving unit (307) for receiving the plate material pressurized by the pressurizing unit, and comprises: an end face pressing upper mold (309) that receives pressurization force from the pressurizing unit; an end face pressing lower mold (311) that is provided on the receiving unit side to face the end face pressing upper mold, an end face (319) of the plate material being inserted between the end face pressing upper mold and the end face pressing lower mold; an end face pressing unit (313) that presses the end face of the plate material by relatively moving the end face pressing upper mold to the end face pressing lower mold side; and an end face pressing width adjustment unit (315) that sets the pressing width of the end face of the plate material.
Inventors:
JIN YINGJUN (JP)
SHIBATA TAKAHIRO (JP)
KOYAMA JUNICHI (JP)
SHIBATA TAKAHIRO (JP)
KOYAMA JUNICHI (JP)
Application Number:
PCT/JP2012/078319
Publication Date:
May 10, 2013
Filing Date:
November 01, 2012
Export Citation:
Assignee:
AMADA CO LTD (JP)
International Classes:
B21D5/02; B21D1/06
Foreign References:
| JPS636115U | 1988-01-16 | |||
| JP2000107817A | 2000-04-18 | |||
| JPS6457922A | 1989-03-06 | |||
| JPH10137852A | 1998-05-26 | |||
| JP2005177790A | 2005-07-07 | |||
| JP2006015404A | 2006-01-19 | |||
| JP2012157902A | 2012-08-23 |
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
Hidekazu Miyoshi (JP)
Hidekazu Miyoshi (JP)
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Claims: