Title:
PLATED MATERIAL AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/176243
Kind Code:
A1
Abstract:
The present invention provides: a plated material which has low insertion force (frictional force) and good durability at high humidities; and an electronic component. A plated material which is provided with: a base plating layer that is provided on the surface of a base material, while being composed of Ni or an Ni alloy; and a surface layer that is provided on the base plating layer, while being composed of an Sn-In-Cu alloy.
Inventors:
KATAYAMA KOICHI (JP)
TAKAHASHI TOMOAKI (JP)
NARUI HIRONORI (JP)
OE ATSUO (JP)
TAKAHASHI TOMOAKI (JP)
NARUI HIRONORI (JP)
OE ATSUO (JP)
Application Number:
PCT/JP2021/033595
Publication Date:
August 25, 2022
Filing Date:
September 13, 2021
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D5/12; C25D5/50; H01R13/03
Foreign References:
| JP2009263785A | 2009-11-12 | |||
| JP2007204854A | 2007-08-16 | |||
| JP2010265540A | 2010-11-25 | |||
| JPH11279791A | 1999-10-12 | |||
| JP2009263786A | 2009-11-12 | |||
| JP2007321177A | 2007-12-13 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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