Title:
PLATING METHOD AND ELECTROLYTIC PLATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/093023
Kind Code:
A1
Abstract:
An electrolytic plating device (2) is provided with: a cathode (20) which is connected to an electroconductive layer (12); an anode (21) which is arranged below a substrate (1) so as to face the other surface of the substrate (1); and an electrolytic plating liquid supply unit (23) which causes an electrolytic liquid (L) to flow between the other surface of the substrate (1) and the anode (21). The electrolytic plating device (2) is constructed so as to cause the electrolytic plating liquid (L) to flow between the other surface of an insulation layer (11) and the anode (21) by means of the electrolytic plating liquid supply unit (23), and also to discharge the electrolytic plating liquid (L), which is between the other surface of the insulation layer (11) and the anode (21), below the other surface of the insulation layer (11). As a result, a plating method and an electrolytic plating device capable of stable plating are provided.
Inventors:
MAKINO NATSUKI (JP)
KATO MASAAKI (JP)
KATO MASAAKI (JP)
Application Number:
PCT/JP2011/000191
Publication Date:
August 04, 2011
Filing Date:
January 17, 2011
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
MAKINO NATSUKI (JP)
KATO MASAAKI (JP)
MAKINO NATSUKI (JP)
KATO MASAAKI (JP)
International Classes:
C25D5/08; C25D7/00; C25D7/06; C25D17/08; H05K3/18
Foreign References:
| JP2006328476A | 2006-12-07 | |||
| JP2007023368A | 2007-02-01 | |||
| JP2006265709A | 2006-10-05 | |||
| JP2004359994A | 2004-12-24 |
Attorney, Agent or Firm:
HAYAMI, SHINJI (JP)
Shinji Hayami (JP)
Shinji Hayami (JP)
Download PDF:
Claims: