PLATING SOLUTION AND PLATING METHOD

Title:

PLATING SOLUTION AND PLATING METHOD

Document Type and Number:

WIPO Patent Application WO/2023/286229

Kind Code:

A1

Abstract:

A plating solution according to one embodiment of the present disclosure contains: an ionic liquid that contains an aluminum halide; and a reducing agent that contains at least one of hydrazine and a hydrazine derivative. In addition, the content of the aluminum halide in the ionic liquid is 30 (mol%) to 60 (mol%).

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Inventors:

SHIBATA TAKAAKI (JP)
IWASHITA MITSUAKI (JP)
KOURA SETSUKO (JP)

Application Number:

PCT/JP2021/026564

Publication Date:

January 19, 2023

Filing Date:

July 15, 2021

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Assignee:

TOKYO ELECTRON LTD (JP)
CHIBA INSTITUTE OF TECH (JP)

International Classes:

C23C18/52

Domestic Patent References:

WO2017187701A1

2017-11-02

Foreign References:

JP2010535939A	2010-11-25
JP2008013845A	2008-01-24

Other References:

KOHEI MAKINO, DAISUKE MARUMOTO AND SETSUKO KOURA: "Examination of Reducing Agents Used for Aluminum Electroless Deposition", IOPSCIENCE - ECS MEETING ABSTRACTS, vol. MA2020-0, no. 68, 1 January 2020 (2020-01-01), pages 1 - 4, XP093024730

Attorney, Agent or Firm:

SAKAI INTERNATIONAL PATENT OFFICE (JP)

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