Title:
POLISHING AND CLEANING METHOD, CLEANING AGENT, AND POLISHING/CLEANING SET
Document Type and Number:
WIPO Patent Application WO/2022/070970
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for satisfactorily cleaning a substrate comprising a high-hardness material after the polishing of the substrate. Provided is a method for polishing and cleaning a substrate comprising a material having a Vickers hardness of 1500 Hv or more. This method comprises: a step for polishing a substrate of interest with a polishing composition; and a step for cleaning the polished substrate with a cleaning agent. The polishing composition contains a polishing auxiliary agent. The cleaning agent contains a surfactant.
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Inventors:
HIRAKO SACHIKO (JP)
NOGUCHI NAOTO (JP)
NOGUCHI NAOTO (JP)
Application Number:
PCT/JP2021/034213
Publication Date:
April 07, 2022
Filing Date:
September 17, 2021
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C11D1/02; H01L21/304
Domestic Patent References:
| WO2013088928A1 | 2013-06-20 |
Foreign References:
| JP2010109329A | 2010-05-13 | |||
| JP2016093880A | 2016-05-26 | |||
| JP2020164596A | 2020-10-08 | |||
| JP2017523950A | 2015-10-20 | |||
| JP2013010888A | 2013-01-17 | |||
| JP5659152B2 | 2015-01-28 |
Attorney, Agent or Firm:
ABE, Makoto (JP)
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